The SMT footprint drawing provided on the datasheet for the Pico W is very poor in re-use of the letters A, B, C, and D to refer to different items on the drawing.
I have four mounting pad positions shown labelled as A, B, C, and D which are the pads for the USB through-hole shield point connections.
I have on the right side, A, B PAD GEOMETRY and below that, B, C PAD GEOMETRY
So, this appears to be a mistake and the second line should be C, D PAD GEOMETRY.
Please confirm this.
I have three test points shown, and another three, without any reference, which I assume relate to TP1 to TP6 inclusive, and below, three further testpoints labelled E, F, G, which I assume are SWCLK, GND, and SWDIO.
This drawing is not clear and should be improved.
I have four mounting pad positions shown labelled as A, B, C, and D which are the pads for the USB through-hole shield point connections.
I have on the right side, A, B PAD GEOMETRY and below that, B, C PAD GEOMETRY
So, this appears to be a mistake and the second line should be C, D PAD GEOMETRY.
Please confirm this.
I have three test points shown, and another three, without any reference, which I assume relate to TP1 to TP6 inclusive, and below, three further testpoints labelled E, F, G, which I assume are SWCLK, GND, and SWDIO.
This drawing is not clear and should be improved.
Statistics: Posted by Pighill_Jimster — Tue Apr 09, 2024 2:25 pm