That's done for memory and large Intel cores, but the likelihood of a defect occurring in either the small areas of the ARM or Risc-V processors is minimally small. I doubt if you'd get one tagged like this in every FOUP of 25 wafers. Cheaper just to bin it than go to the effort of packaging and selling it separately.the main use i can see for that, is to be able to sell chips with manufacturing defects in the arm core (or risc-v core)We are able to permanently fuse out either the Arm cores or the RISC-V cores during production test using the CRIT0 flags
test it at the factory, and then fuse off the defective cores
Statistics: Posted by MikeDB — Thu Aug 29, 2024 5:05 pm
